In case of laser depaneling, the thermal energy of the laser is used to remove the material path by path / layer by layer. With each repitition, a pre-defined thickness of the material is ablated and vaporised. The resulting fumes are extracted during the process by a powerful suction system. Due to the small particles and the powerful suction, the deposition of residues is reduced to a minimum. In addition, the thermal energy is regulated during the entire process in such a way that, depending on the specific requirements, there is no or only very little carbonisation of the material.
Due to the layer-by-layer ablation process of the laser, it is not only possible to cut through the boards completely, but also to remove individual layers or predefined thicknesses of the material. Due to the precision and filigree of the laser, ablations can be performed with an accuracy of a few µm.